Intel and Lens Technology Collaborate to Advance Semiconductor Packaging for the AI Era
The companies will explore glass substrate-based packaging technologies for AI, data centre, and next-generation computing systems.
SANTA CLARA, Calif. and CHANGSHA, China, July 24, 2026 — Intel Corporation (NASDAQ: INTC) and Lens Technology (SEHK: 6613-HK) have announced a strategic collaboration focused on next-generation semiconductor packaging for AI and high-performance computing platforms.
The companies will combine Intel’s expertise in advanced semiconductor packaging with Lens Technology’s precision glass processing and manufacturing capabilities to evaluate glass substrate-based packaging solutions.
The collaboration aims to support future computing platforms by improving performance, increasing interconnect density, and enhancing power efficiency for AI, data centre, and specialised computing applications.
How Intel and Lens Technology Will Work Together
Intel and Lens Technology will combine their respective technical expertise to develop glass substrate-based packaging technologies.
Intel will contribute its experience in semiconductor architecture and advanced packaging technologies, while Lens Technology will provide capabilities in precision glass processing, glass substrate research and development, precision manufacturing, and process innovation.
Together, these complementary capabilities support future glass substrate-based packaging for AI, data centre, and specialised computing applications.
Potential Areas of Future Collaboration
Intel and Lens Technology also plan to collaborate in additional areas beyond advanced semiconductor packaging. The collaboration will evaluate cooperation in critical manufacturing processes to help scale the adoption of these packaging technologies.
Potential areas of future collaboration include components for AI PCs, structural and thermal solutions for data centre servers, and hardware platforms supporting AI robotics, intelligent industrial equipment, and edge computing.
Executive Statements
Lip-Bu Tan, CEO of Intel, discussed how the collaboration combines the strengths of both companies to advance semiconductor packaging technologies for AI.
“Advanced packaging is becoming a critical driver of semiconductor innovation as AI systems continue to push the boundaries of performance, scale, and efficiency.
Intel brings deep expertise in semiconductor architecture and advanced packaging technologies, while Lens Technology contributes world-class capabilities in precision glass processing, laser manufacturing, and large-scale production.
Together, we have an opportunity to explore new approaches to advanced packaging that can help unlock the next generation of system-level innovation for the AI era.”
June Chau, founder and chairwoman of Lens Technology, highlighted how the companies’ combined expertise could accelerate the development of advanced packaging technologies.
“By combining Lens Technology’s expertise in glass materials, high-precision laser processing, and advanced manufacturing with Intel’s leadership in semiconductor design and packaging, we believe we can help accelerate innovation in advanced packaging technologies.
This collaboration will support the rapid development of next-generation computing solutions and AI infrastructure for customers around the world.”
About Intel
Intel is a semiconductor company that designs and manufactures processors, computing platforms, and advanced semiconductor technologies for consumer, enterprise, and data centre markets.
The company also develops advanced packaging, foundry, and manufacturing technologies to support next-generation computing and AI applications.
About Lens Technology
Lens Technology is a precision manufacturing company specializing in glass materials, advanced manufacturing, and precision processing technologies.
The company develops components and manufacturing solutions for consumer electronics, automotive, and emerging AI-related technologies.
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Editorial Note: This article was independently prepared by the NogenTech editorial team based on information published in Intel’s official announcement. It is intended for informational and editorial purposes and should not be considered an official Intel press release.
Source: Intel Newsroom
